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參數(shù)資料
| 型號： | MCZ33390EFR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 10/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX SERIAL LINK 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | J-1850 |
| 電源電壓： | 9 V ~ 16 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 帶卷 (TR) |
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33390
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VBAT DC Supply Voltage (1)
VBAT
-0.3 to 40
V
Input I/O Pins (2)
VI/O(CPU)
-0.3 to 7.0
V
BUS and LOAD Outputs
VBUS
-2.0 to 16
V
ESD Voltage (3)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-65 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
TPPRT
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
180
°C/W
Notes
1.
An external series diode must be used to provide reverse battery protection of the device.
2.
SLEEP
, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3.
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP=200 pF, RZAP=0 ).
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
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