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參數(shù)資料
| 型號： | MCZ33390EF |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 4/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX SERIAL LINK 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 98 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | J-1850 |
| 電源電壓： | 9 V ~ 16 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 管件 |
Analog Integrated Circuit Device Data
12
Freescale Semiconductor
33390
TYPICAL APPLICATIONS
“start of frame” bit has been transmitted, the secondary node
transmitting the most consecutive logic [0] bits will be granted
sole transmission access to the bus for that message.
Loss of Assembly Ground Connection
The definition of a loss of assembly ground condition at the
device level is that all pins of the 33390, with the exception of
BUS and LOAD, see a very low impedance to VBAT.
The LOAD pin of the device has an internal transistor
switch connected to it that is normally saturated to ground.
This pulls the LOAD-side of the external resistor (tied from
BUS to LOAD) to ground under normal conditions. The LOAD
pin switch is essentially that of an “upside down” FET, which
is normally biased “on” so long as module ground is present
and biased “off” when loss-of-ground occurs. When a loss of
assembly ground occurs, the load transistor switch is self-
biased “off”, allowing no more than 100 A of leakage current
to flow in the LOAD pin. During such a loss of assembly
ground condition, the BUS and LOAD pins exhibit a high
impedance to VBAT; all other pins will exhibit a low
impedance to VBAT. During this condition the BUS pin is
prevented from sourcing any current or loading the bus,
which would cause a corruption of any data being transmitted
on the bus. While a particular assembly is experiencing a loss
of ground, all other assembly nodes are permitted to function
normally. It should be noted that with other nodes existing on
the bus, the bus will always have some minimum/maximum
impedance to ground as shown in Table 5, page 10.
Loss of Assembly Battery Connection
The definition of a loss of assembly battery condition at the
device level is that the VBAT pin of the 33390 sees an infinite
impedance to VBAT, but there is some undefined impedance
between these pins and ground.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MCZ33390EFR2 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC J1850 SERIAL TRANSCEIVER RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33395EW | 功能描述:馬達(dá)/運(yùn)動/點火控制器和驅(qū)動器 3 PHASE MOTOR DRIVER RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MCZ33395EWR2 | 功能描述:馬達(dá)/運(yùn)動/點火控制器和驅(qū)動器 3 PHASE MOTOR DRIVER RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MCZ33399EF | 功能描述:輸入/輸出控制器接口集成電路 LIN INTERFACE RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| MCZ33399EFR2 | 功能描述:輸入/輸出控制器接口集成電路 LIN INTERFACE RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
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