參數(shù)資料
型號: MCRF250
廠商: Microchip Technology Inc.
英文描述: 125 kHz microID Passive RFID Device with Anti-Collision
中文描述: 125千赫microID無源RFID設(shè)備與反碰撞
文件頁數(shù): 14/24頁
文件大?。?/td> 395K
代理商: MCRF250
MCRF250
DS21267F-page 14
2003 Microchip Technology Inc.
7.0
FAILED DIE IDENTIFICATION
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage such as mechanical
cracks and scratches.
Any failed die in the test or visual inspection is identified
by black colored inking. Therefore, any die covered
with black ink should not be used.
The ink dot specification:
Ink dot size: minimum 20
μ
m x 20
μ
m
Position: central third of die
Color: black
8.0
WAFER DELIVERY
DOCUMENTATION
Each wafer container is marked with the following
information:
Microchip Technology Inc. MP Code
Lot Number
Total number of wafer in the container
Total number of good dice in the container
Average die per wafer (DPW)
Scribe number of wafer with number of good dice.
9.0
NOTICE ON DIE AND WAFER
HANDLING
The device is very susceptible to Electrostatic
Discharge (ESD). ESD can cause critical damage to
the device. Special attention is needed during the
handling process.
Any ultraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Fluorescent lights
and sun light can also erase the memory cell although
it takes more time than UV lamps. Therefore, keep any
unpackaged devices out of UV light and also avoid
direct exposure from strong fluorescent lights and sun
light.
Certain integrated circuit (IC) manufacturing, chip-on-
board (COB) and tag assembly operations may use UV
light. Operations such as backgrind, de-tape, certain
cleaning operations, epoxy or glue cure should be done
without exposing the die surface to UV light.
Using x-ray for die inspection will not harm the die, nor
erase memory cell contents.
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