參數(shù)資料
型號(hào): MCP9803-M/MSG
元件分類(lèi): 溫度/濕度傳感器
英文描述: DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 3Cel, SQUARE, SURFACE MOUNT
封裝: LEAD FREE, PLASTIC, MO-187, MSOP-8
文件頁(yè)數(shù): 15/30頁(yè)
文件大小: 478K
代理商: MCP9803-M/MSG
MCP9800/1/2/3
DS21909B-page 22
2004 Microchip Technology Inc.
6.0
APPLICATIONS INFORMATION
6.1
Connecting to the Serial Bus
The SDA and SCLK serial interface are open-drain pins
that require pull-up resistors. This configuration is
shown in Figure 6-1.
FIGURE 6-1:
Pull-up Resistors On Serial
Interface.
For the SMBus protocol, the number of devices con-
nected to the bus are limited only by the maximum rise
and fall times of the SDA and SCLK lines. Unlike the
I2C specifications, SMBus does not specify a maximum
bus capacitance value. Rather, it specifies 350 A
(max.) current through the pull-up resistor. Therefore,
the value of the pull-up resistors will vary depending on
the system’s supply voltage (VDD). The pull-up resistor
values for a 5V system ranges 14.3 k
to 50 k.
Minimizing bus capacitance is still very important, as it
directly affects the rise and fall times of the SDA and
SCLK lines.
Although SMBus specifications only require the SDA
and SCLK lines to pull down 350 A (max.) with 0.4V
(max.) voltage drop, the MCP9800/1/2/3 is designed to
meet 0.4V (max.) voltage drop at 3 mA of current. This
allows the MCP9800/1/2/3 to drive lower values of pull-
up resistors and higher bus capacitance. In this
application, all devices on the bus must meet the same
pull-down current requirements.
6.2
Typical Application
Microchip provides several microcontroller product
lines with Master Synchronous Serial Port Modules
(MSSP) that include I2C interface mode. This module
implements all master and slave functions and simpli-
fies the firmware development overhead. Figure 6-2
shows a typical application using the PIC16F737 as a
master to control other Microchip slave products, such
as EEPROM, fan speed controllers and the MCP980X
temperature sensor connected to the bus.
FIGURE 6-2:
Multiple Devices on SMBus.
The ALERT output can be wire-ORed with a number of
other open-drain devices. In such applications, the
output needs to be programmed as an active-low
output. Most systems will require pull-up resistors for
this configuration.
6.3
Layout Considerations
The MCP9800/1/2/3 does not require any additional
components besides the Master controller in order to
measure temperature. However, it is recommended
that a decoupling capacitor of 0.1 F to 1 F be used
between the VDD and GND pins. A high-frequency
ceramic capacitor is recommended. It is necessary for
the capacitor to be located as close as possible to the
power pins in order to provide effective noise
protection.
6.4
Thermal Considerations
The
MCP9800/1/2/3
measures
temperature
by
monitoring the voltage of a diode located in the die. A
low impedance thermal path between the die and the
Printed Circuit Board (PCB) is provided by the pins.
Therefore, the MCP9800/1/2/3 effectively monitors the
temperature of the PCB. However, the thermal path for
the ambient air is not as efficient because the plastic
device package functions as a thermal insulator.
A potential for self-heating errors can exist if the
MCP9800/1/2/3 SDA and SCLK communication lines
are heavily loaded with pull-ups. Typically, the self-
heating error is negligible because of the relatively
small current consumption of the MCP9800/1/2/3.
However, in order to maximize the temperature
accuracy, the SDA and SCLK pins need to be lightly
loaded.
PICm
icro
SDA
SCLK
VDD
R
M
icroc
ontroll
er
MCP980X
SDA SCLK
PIC16F737
Microcontroller
MCP980X
Temperature
Sensor
24LC01
EEPROM
TC654
Fan Speed
Controller
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