參數(shù)資料
型號(hào)： MCP6144
廠商： Microchip Technology Inc.
英文描述： 600 nA, Non-Unity Gain Rail-to-Rail Input/Output Op Amps
中文描述： 600 nA的，非統(tǒng)一增益軌到軌輸入/輸出運(yùn)算放大器
文件頁(yè)數(shù)： 12/32頁(yè)
文件大?。?/td> 624K
代理商： MCP6144
MCP6141/2/3/4
21668A-page 12
2002 Microchip Technology Inc.
FIGURE 3-5:
function on the MCP6143 op amp.
Timing Diagram for the CS
3.8
Layout Considerations
Good PC board layout techniques will help you achieve
the performance shown in the specifications and typical
performance curves. It will also assist in minimizing
Electro-Magnetic Compatibility (EMC) issues.
3.8.1
SURFACE LEAKAGE
In applications where low input bias current is critical,
PC board surface leakage effects and signal coupling
from trace to trace need to be considered.
Surface leakage is caused by a difference in voltage
between traces, combined with high humidity, dust or
other contamination on the board. Under low humidity
conditions, a typical resistance between nearby traces
is 10
12
. A 5V difference would cause 5 pA of current
to flow, which is greater than the input current of the
MCP6141/2/3/4 family at 25°C (1 pA, typ).
The simplest technique to reduce surface leakage is
using a guard ring around sensitive pins (or traces).
The guard ring is biased at the same voltage as the
sensitive pin or trace. Figure 3-6 shows an example of
a typical layout.
FIGURE 3-6:
layout.
Example of Guard Ring
Circuit schematics for different guard ring implementa-
tions are shown in Figure 3-7. Figure 3-7A biases the
guard ring to the input common mode voltage, which is
most effective for non-inverting gains. Figure 3-7B
biases the guard ring to a reference voltage (V
REF
,
which can be ground), which is useful for inverting
gains and precision photo sensing circuits.
FIGURE 3-7:
connection strategies to reduce surface leakage
effects.
Two possible guard ring
3.8.2
COMPONENT PLACEMENT
In order to help prevent crosstalk:
Separate digital components from analog compo-
nents, and low speed devices from high speed
devices.
Keep sensitive traces short and straight. Separate
them from interfering components and traces.
This is especially important for high frequency
(low rise time) signals.
Use a 0.1 μF supply bypass capacitor within 0.1”
(2.5 mm) of the V
DD
pin. It must connect directly
to the ground plane.
V
IL
Hi-Z
t
ON
V
IH
CS
t
OFF
V
OUT
I
VDD
20 pA, typ
Hi-Z
I
VSS
I
CS
5 pA, typ
5 pA, typ
20 pA, typ
0.6 μA, typ
5 pA, typ
0.6 μA, typ
5 pA, typ
Guard Ring
V
SS
IN-
IN+
V
REF
MCP614X
Figure 3-7A
Figure 3-7B
V
DD
V
REF
MCP614X
V
DD
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP6144-E/P 功能描述:運(yùn)算放大器 - 運(yùn)放 G>10 Qd 1.6V 100kHz RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6144-E/SL 功能描述:運(yùn)算放大器 - 運(yùn)放 G>10 Qd 1.6V 100kHz RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6144-E/ST 功能描述:運(yùn)算放大器 - 運(yùn)放 G>10 Qd 1.6V 100kHz RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6144-I/P 功能描述:運(yùn)算放大器 - 運(yùn)放 G>10 Qd 1.6V 100kHz RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP6144-I/P 制造商:Microchip Technology Inc 功能描述:IC OP-AMP QUAD LOW-POWER RRI/O
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