參數(shù)資料
型號: MCP6002T-I/MS
廠商: Microchip Technology
文件頁數(shù): 3/42頁
文件大?。?/td> 0K
描述: IC OPAMP 1.8V 1MHZ DUAL 8-MSOP
標準包裝: 1
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.6 V/µs
增益帶寬積: 1MHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 4500µV
電流 - 電源: 100µA
電流 - 輸出 / 通道: 23mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 8-MSOP
包裝: 標準包裝
產(chǎn)品目錄頁面: 678 (CN2011-ZH PDF)
其它名稱: MCP6002T-I/MSDKR
2009 Microchip Technology Inc.
DS21733J-page 11
MCP6001/1R/1U/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6001 MCP6001R MCP6001U
MCP6002
MCP6004
Symbol
Description
SC70-5,
SOT-23-5
MSOP,
PDIP,
SOIC
DFN
2x3
PDIP,
SOIC,
TSSOP
11
4
1
VOUT, VOUTA Analog Output (op amp A)
44
3
2
VIN–, VINA– Inverting Input (op amp A)
33
1
3
VIN+, VINA+ Non-inverting Input (op amp A)
52
5
8
4
VDD
Positive Power Supply
——
5
VINB+
Non-inverting Input (op amp B)
——
6
VINB
Inverting Input (op amp B)
——
7
VOUTB
Analog Output (op amp B)
——
8
VOUTC
Analog Output (op amp C)
——
9
VINC
Inverting Input (op amp C)
——
10
VINC+
Non-inverting Input (op amp C)
25
2
4
11
VSS
Negative Power Supply
——
12
VIND+
Non-inverting Input (op amp D)
——
13
VIND
Inverting Input (op amp D)
——
14
VOUTD
Analog Output (op amp D)
9
EP
Exposed Thermal Pad (EP);
must be connected to VSS.
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