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| 型號： | MCP6001EOT |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 1 MHz Bandwidth Low Power Op Amp |
| 中文描述： | 1 MHz帶寬低功耗運算放大器 |
| 文件頁數(shù)： | 19/24頁 |
| 文件大?。?/td> | 553K |
| 代理商： | MCP6001EOT |
2003 Microchip Technology Inc.
DS21733D-page 19
MCP6001/2/4
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
Foot Angle
Lead Thickness
φ
c
0
4
8
0
4
8
15
12
0
15
12
0
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
15
12
0
15
12
0
α
Mold Draft Angle Top
0.51
0.42
0.36
.020
.017
.014
B
Lead Width
0.25
0.23
0.20
.010
.009
.008
1.27
0.84
0.41
.050
.033
.016
L
Foot Length
0.51
0.38
0.25
.020
.015
.010
h
Chamfer Distance
8.81
8.69
8.56
.347
.342
.337
D
Overall Length
3.99
3.90
3.81
.157
.154
.150
E1
Molded Package Width
6.20
5.99
5.79
.244
.236
.228
E
Overall Width
0.25
0.18
0.10
.010
.007
.004
A1
Standoff
§
1.55
1.42
1.32
.061
.056
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.061
.053
A
Overall Height
1.27
.050
p
Pitch
14
14
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
p
n
B
E
E1
h
L
c
β
45
°
φ
α
A2
A
A1
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MCP6001EP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001ESL | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001ESN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001EST | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6001I | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
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