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參數(shù)資料
| 型號(hào)： | MCP3901A0T-I/SS |
| 廠商： | Microchip Technology |
| 文件頁(yè)數(shù)： | 16/30頁(yè) |
| 文件大小： | 0K |
| 描述： | IC AFE 24BIT 64KSPS 20-SSOP |
| 產(chǎn)品培訓(xùn)模塊： | MCP3901 Analog Front End |
| 標(biāo)準(zhǔn)包裝： | 1,600 |
| 位數(shù)： | 24 |
| 通道數(shù)： | 2 |
| 電壓 - 電源，模擬： | 4.5 V ~ 5.5 V |
| 電壓 - 電源，數(shù)字： | 2.7 V ~ 5.5 V |
| 封裝/外殼： | 20-SSOP（0.209"，5.30mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SSOP |
| 包裝： | 帶卷 (TR) |
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PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
23 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 17.
Table 16.
PCA2002 wafer information
Type number
Wafer thickness
Wafer diameter
FFC for wafer size
Marking of bad die
PCA2002U/10AB/1
0.20 mm
6 inch
inking
PCA2002CX8/5/1
0.69 mm
6 inch
wafer mapping
PCA2002CX8/12/1
0.20 mm
6 inch
8 inch
wafer mapping
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