參數(shù)資料
型號: MCP23S08-E/ML
廠商: Microchip Technology
文件頁數(shù): 27/44頁
文件大小: 0K
描述: IC I/O EXPANDER SPI 8B 20QFN
標準包裝: 91
接口: SPI
輸入/輸出數(shù): 8
中斷輸出:
頻率 - 時鐘: 10MHz
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤
供應商設備封裝: 20-QFN 裸露焊盤(4x4)
包裝: 托盤
包括: POR
產品目錄頁面: 684 (CN2011-ZH PDF)
配用: GPIODM-KPLCD-ND - BOARD DEMO LCD GPIO EXP KEYPAD
2007 Microchip Technology Inc.
DS21919E-page 33
MCP23008/MCP23S08
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
18-Lead PDIP (300 mil)
18-Lead SOIC (300 mil)
20-Lead SSOP
XXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXXXXXX
YYWWNNN
Example:
MCP23008
0634256
MCP23008-E/P^^
0634256
XXXXXXXXXXXX
YYWWNNN
MCP23S08
XXXXXXXXXXXX
0634256
E/SO^^
E/SS^^
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
)
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
3
e
20-Lead QFN
Example
XXXXX
XXXXXX
YWWNNN
23S08
E/ML^^
0637
256
3
e
相關PDF資料
PDF描述
MCP23S09-E/SO IC I/O EXPANDER SPI 8B 18SOIC
MCP23009-E/P IC I/O EXPANDER I2C 8B 18DIP
MCP23009-E/SS IC I/O EXPANDER I2C 8B 20SSOP
MCP23009-E/SO IC I/O EXPANDER I2C 8B 18SOIC
MCP23008-E/P IC I/O EXPANDER I2C 8B 18DIP
相關代理商/技術參數(shù)
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