V
參數(shù)資料
型號(hào)： MCP2200T-I/SO
廠商： Microchip Technology
文件頁(yè)數(shù)： 4/34頁(yè)
文件大?。?/td> 0K
描述： IC USB 2.0 - UART 20SOIC
標(biāo)準(zhǔn)包裝： 1,600
特點(diǎn)： USB 至 UART
通道數(shù)： 8
FIFO's： 256 字節(jié)
規(guī)程： USB 2.0
電源電壓： 3 V ~ 5.5 V
帶自動(dòng)流量控制功能： 是
安裝類型： 表面貼裝
封裝/外殼： 20-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 20-SOIC
包裝： 帶卷 (TR)
MCP2003/4/3A/4A
DS22230D-page 12
2010-2011 Microchip Technology Inc.
2.0
ELECTRICAL CHARACTERISTICS
2.1
Absolute Maximum Ratings
VIN DC Voltage on RXD, TXD, FAULT/TXE, CS ............................................................................................. -0.3 to +43V
VIN DC Voltage on WAKE and VREN .............................................................................................................-0.3 to +VBB
VBB Battery Voltage, continuous, non-operating (Note 1)............................................................................. -0.3 to +40V
VBB Battery Voltage, non-operating (LIN bus recessive) (Note 2) ................................................................ -0.3 to +43V
VBB Battery Voltage, transient ISO 7637 Test 1 ..................................................................................................... -200V
VBB Battery Voltage, transient ISO 7637 Test 2a ...................................................................................................+150V
VBB Battery Voltage, transient ISO 7637 Test 3a ................................................................................................... -300V
VBB Battery Voltage, transient ISO 7637 Test 3b ...................................................................................................+200V
VLBUS Bus Voltage, continuous ...................................................................................................................... -18 to +40V
VLBUS Bus Voltage, transient (Note 3) ........................................................................................................... -27 to +43V
ILBUS Bus Short Circuit Current Limit ....................................................................................................................200 mA
ESD protection on LIN, VBB, WAKE (IEC 61000-4-2) (Note 4)............................................................................... ±8 KV
ESD protection on LIN, VBB (Human Body Model) (Note 5) ................................................................................... ±8 KV
ESD protection on all other pins (Human Body Model) (Note 5) ............................................................................ ±4 KV
ESD protection on all pins (Charge Device Model) (Note 6)................................................................................... ±2 KV
ESD protection on all pins (Machine Model) (Note 7).............................................................................................±200V
Maximum Junction Temperature ............................................................................................................................. 150
°C
Storage Temperature...................................................................................................................................-65 to +150
°C
Note 1: LIN 2.x compliant specification.
2: SAE J2602 compliant specification.
3: ISO 7637/1 load dump compliant (t < 500 ms).
4: According to IEC 61000-4-2, 330 ohm, 150 pF and Transceiver EMC Test Specifications [2] to [4]. For WAKE
pin to meet the specification, series resistor must be in place (refer to Example 1-2).
5: According to AEC-Q100-002 / JESD22-A114.
6: According to AEC-Q100-011B.
7: According to AEC-Q100-003 / JESD22-A115.
2.2
Nomenclature used in this document
Some terms and names used in this data sheet deviate from those referred to in the LIN specifications. Equivalent
values are shown below.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device, at those or any other conditions above those
indicated in the operational listings of this specification, is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
LIN 2.1 Name
Term used in the following tables
Definition
V
BAT
not used
ECU operating voltage
V
SUP
VBB
Supply voltage at device pin
I
BUS
_LIM
ISC
Current Limit of Driver
V
BUSREC
VIH(LBUS)
Recessive state
V
BUSDOM
VIL(LBUS)
Dominant state
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