參數(shù)資料
型號: MCP2004T-E/SN
廠商: Microchip Technology
文件頁數(shù): 23/34頁
文件大小: 0K
描述: IC TXRX LIN B/DIR 8SOIC
產(chǎn)品培訓模塊: Microchip MCP20xx LIN Transceiver Overview
標準包裝: 3,300
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: LIN
電源電壓: 6 V ~ 27 V
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOICN
包裝: 帶卷 (TR)
2010-2011 Microchip Technology Inc.
DS22230D-page 3
MCP2003/4/3A/4A
1.0
DEVICE OVERVIEW
The MCP2003/4/3A/4A devices provide a physical
interface between a microcontroller and a LIN bus.
These devices will translate the CMOS/TTL logic levels
to LIN logic level, and vice versa. It is intended for
automotive and industrial applications with serial bus
speeds up to 20 Kbaud.
LIN specification 2.1 requires that the transceiver of all
nodes in the system is connected via the LIN pin, refer-
enced to ground and with a maximum external
termination resistance load of 510
Ω from LIN bus to
battery supply. The 510
Ω corresponds to 1 master and
15 slave nodes.
The VREN pin can be used to drive the logic input of an
external voltage regulator. This pin is high in all modes
except for Power-Down mode.
1.1
External Protection
1.1.1
REVERSE BATTERY PROTECTION
An external reverse-battery-blocking diode should be
used to provide polarity protection (see Example 1-1).
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
An external 43V transient suppressor (TVS) diode,
between VBB and ground, with a 50
Ω transient
protection resistor (RTP) in series with the battery
supply and the VBB pin serve to protect the device from
power transients (see Example 1-1) and ESD events.
While this protection is optional, it is considered good
engineering practice.
1.2
Internal Protection
1.2.1
ESD PROTECTION
For component-level ESD ratings, please refer to the
maximum operation specifications.
1.2.2
GROUND LOSS PROTECTION
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a high-impedance level.
1.2.3
THERMAL PROTECTION
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter.
There are two causes for a thermal overload. A thermal
shut down can be triggered by either, or both, of the
following thermal overload conditions.
LIN bus output overload
Increase in die temperature due to increase in
environment temperature
Driving the TXD and checking the RXD pin makes it
possible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low). After a thermal overload event,
the device will automatically recover once the die
temperature has fallen below the recovery temperature
threshold. See Figure 1-1.
FIGURE 1-1:
THERMAL SHUTDOWN
STATE DIAGRAM
Operation
Mode
Transmitter
Shutdown
LIN bus
Shorted
to VBB
Temp < SHUTDOWN
TEMP
相關PDF資料
PDF描述
VE-BTM-IV-F3 CONVERTER MOD DC/DC 10V 150W
MCP2003T-E/SN TXRX LIN STAND ALONE 8SOIC
VE-BTL-IV-F1 CONVERTER MOD DC/DC 28V 150W
VE-BTK-IV-F1 CONVERTER MOD DC/DC 40V 150W
VE-BTJ-IV-F4 CONVERTER MOD DC/DC 36V 150W
相關代理商/技術參數(shù)
參數(shù)描述
MCP200JR-100K 功能描述:RES 100K OHM 2W 5% MELF RoHS:是 類別:電阻器 >> 芯片電阻 - 表面安裝 系列:MCP 產(chǎn)品目錄繪圖:RHM Series Top RHM Series Side 標準包裝:5,000 系列:MCR10 電阻(歐姆):27 功率(瓦特):0.125W,1/8W 復合體:厚膜 特點:- 溫度系數(shù):±200ppm/°C 容差:±5% 封裝/外殼:0805(2012 公制) 尺寸/尺寸:0.079" L x 0.049" W(2.00mm x 1.25mm) 高度:0.026"(0.65mm) 端子數(shù):2 包裝:帶卷 (TR) 產(chǎn)品目錄頁面:2225 (CN2011-ZH PDF) 其它名稱:RHM27ATR
MCP200JR-100R 功能描述:RES 100 OHM 2W 5% MELF RoHS:是 類別:電阻器 >> 芯片電阻 - 表面安裝 系列:MCP 標準包裝:4,000 系列:RCL - 汽車 電阻(歐姆):30.9 功率(瓦特):1W 復合體:厚膜 特點:- 溫度系數(shù):±100ppm/°C 容差:±1% 封裝/外殼:1812(4632 公制)寬(長端),1218(3246 公制) 尺寸/尺寸:0.126" L x 0.181" W(3.20mm x 4.60mm) 高度:0.024"(0.60mm) 端子數(shù):2 包裝:帶卷 (TR)
MCP200JR-10K 功能描述:RES 10K OHM 2W 5% MELF RoHS:是 類別:電阻器 >> 芯片電阻 - 表面安裝 系列:MCP 產(chǎn)品目錄繪圖:RHM Series Top RHM Series Side 標準包裝:5,000 系列:MCR10 電阻(歐姆):27 功率(瓦特):0.125W,1/8W 復合體:厚膜 特點:- 溫度系數(shù):±200ppm/°C 容差:±5% 封裝/外殼:0805(2012 公制) 尺寸/尺寸:0.079" L x 0.049" W(2.00mm x 1.25mm) 高度:0.026"(0.65mm) 端子數(shù):2 包裝:帶卷 (TR) 產(chǎn)品目錄頁面:2225 (CN2011-ZH PDF) 其它名稱:RHM27ATR
MCP200JR-10R 功能描述:RES 10 OHM 2W 5% MELF RoHS:是 類別:電阻器 >> 芯片電阻 - 表面安裝 系列:MCP 產(chǎn)品目錄繪圖:RHM Series Top RHM Series Side 標準包裝:5,000 系列:MCR10 電阻(歐姆):27 功率(瓦特):0.125W,1/8W 復合體:厚膜 特點:- 溫度系數(shù):±200ppm/°C 容差:±5% 封裝/外殼:0805(2012 公制) 尺寸/尺寸:0.079" L x 0.049" W(2.00mm x 1.25mm) 高度:0.026"(0.65mm) 端子數(shù):2 包裝:帶卷 (TR) 產(chǎn)品目錄頁面:2225 (CN2011-ZH PDF) 其它名稱:RHM27ATR
MCP200JR-120R 功能描述:RES 120 OHM 2W 5% MELF RoHS:是 類別:電阻器 >> 芯片電阻 - 表面安裝 系列:MCP 產(chǎn)品目錄繪圖:RHM Series Top RHM Series Side 標準包裝:5,000 系列:MCR10 電阻(歐姆):27 功率(瓦特):0.125W,1/8W 復合體:厚膜 特點:- 溫度系數(shù):±200ppm/°C 容差:±5% 封裝/外殼:0805(2012 公制) 尺寸/尺寸:0.079" L x 0.049" W(2.00mm x 1.25mm) 高度:0.026"(0.65mm) 端子數(shù):2 包裝:帶卷 (TR) 產(chǎn)品目錄頁面:2225 (CN2011-ZH PDF) 其它名稱:RHM27ATR