
MCP1827/MCP1827S
DS22001B-page 24
2006 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (AB) (TO-220)
E
Q
D
D1
E/2
L
PIN 1
L1
b2
PIN n
b
e
e1
φ
P
A
A1
H1
c
A2
5X
α
E1
D2
BOTTOM: VARIANT A
E3
D3
BOTTOM: VARIANT B
D4
1.78
1.45
1.14
.070
.057
.045
b2
Shoulder Width
*Controlling Parameter
1.02
0.69
0.38
.040
.027
.015
b
Lead Width
0.61
-
0.30
.024
-
.012
c
Lead Thickness
8°
-
0
8°
-
0
α
Foot Angle
6.35
-
2.10
.250
-
-
L1
Lead Shoulder
12.88
6.43
-
12.19
6.17
.507
.253
-
.480
.243
D2
D3
Exposed Tab Length
– (SEE BOTTOM VARIANT B)
9.17
-
8.38
.361
-
.330
D1
Molded Package Length
16.51
-
14.22
.650
-
.560
D
Overall Length
3.05
-
2.54
.120
-
.100
Q
Hole Center to Tab Edge
5.08 BSC
.200 BSC
e1
A
Overall Pin Pitch
Overall Height
2.54 BSC
.100 BSC
e
Pitch
3
3
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Drawing No. C04-158
Notes:
6.63
6.50
6.38
.261
.256
.251
E3
– (SEE BOTTOM VARIANT B)
8.89
-
6.86
.350
-
.270
E1
Exposed Tab Width
10.67
-
9.65
.420
-
.380
E
Overall Width
3.05
-
2.03
.120
-
.080
A2
Base to Lead
1.40
-
0.51
.055
-
.020
A1
Tab Thickness
4.83
-
3.56
.190
-
.140
14.73
-
12.70
.580
-
.500
L
Lead Length
3.96
-
3.53
.156
-
.139
φ
P
Mounting Hole Diameter
6.86
-
5.84
.270
-
.230
H1
Tab Length
7.95
7.82
7.70
.313
.308
.303
D4
– (SEE BOTTOM VARIANT B)
6.30
.248
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging