參數(shù)資料
      型號: MCM63P631TQ117R
      廠商: MOTOROLA INC
      元件分類: DRAM
      英文描述: 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM
      中文描述: 64K X 32 CACHE SRAM, 4.5 ns, PQFP100
      封裝: TQFP-100
      文件頁數(shù): 1/27頁
      文件大?。?/td> 328K
      代理商: MCM63P631TQ117R
      MCM63P636
      1
      Motorola, Inc. 1998
      Advance Information
      64K x 36 Bit Pipelined BurstRAM
      Synchronous Fast Static RAM
      The MCM63P636 is a 2M–bit synchronous fast static RAM designed to provide
      burstable, high performance, secondary cache for advanced microprocessors.
      It is organized as 64K words of 36 bits each. This device integrates input regis-
      ters, an output register, a 2–bit address counter, and a high speed SRAM onto
      a single monolithic circuit for reduced parts count in cache data RAM applica-
      tions. Synchronous design allows for precise cycle control with the use of an ex-
      ternal clock (K) and external strobe clock (SK).
      Addresses (SA), data inputs (DQx), and all control signals are clock (K)
      controlled through positive–edge–triggered noninverting registers. Data strobes
      STRBA, STRBA, STRBB, and STRBB are strobe clock (SK) controlled through
      positive–edge–triggered non–inverting registers. Strobe clock, 180 degrees out
      of phase with clock (K), is only used with the data strobes such that they are
      centered with data output on read cycles.
      Burst sequences are initiated with ADS input pin, and subsequent burst
      addresses are generated internally by MCM63P636.
      Write cycles are internally self–timed and are initiated with address and control
      logic by the rising edge of the clock (K) input. This feature eliminates complex
      off–chip write pulse generation and provides increased timing flexibility for
      incoming signals. Special logic enables the memory to accept data on the rising
      edge of clock (K) a cycle after address and control signals.
      For read cycles, the SRAMs output data is temporarily stored by an
      edge–triggered output register and then released to the output buffers at the
      second rising edge of clock (K) for a read latency of three cycles. Data strobes
      rise and fall with SRAM output to help external devices receiving the data to
      latch the data.
      The MCM63P636 operates from a 3.3 V core power supply, a 2.0 V input power
      supply, and a 2.0 V I/O power supply. These power supplies are designed so that
      power sequencing is not required.
      MCM63P636–250 = 3.9 ns Access/4 ns Cycle (250 MHz)
      MCM63P636–225 = 4.3 ns Access/4.4 ns Cycle (225 MHz)
      MCM63P636–200 = 4.9 ns Access/5 ns Cycle (200 MHz)
      3.3 V
      ±
      200 mV VDD Supply, 2.0 V VDDI and VDDQ Supply
      Internally Self–Timed Late Write Cycle
      Three–Cycle Single–Read Latency
      Strobe Clock Input and Data Strobe Output Pins
      On–Chip Output Enable Control
      On–Chip Burst Advance Control
      Four–Tick Burst
      Power–On Reset Pin
      Low Power Stop Clock Operation
      Boundary Scan (PBGA Only)
      JEDEC Standard 153–Pin PBGA and 100–Pin TQFP Packages
      This document contains information on a new product. Specifications and information herein are subject to change without notice.
      Order this document
      by MCM63P636/D
      SEMICONDUCTOR TECHNICAL DATA
      MCM63P636
      ZP PACKAGE
      PBGA
      CASE 1107–01
      TQ PACKAGE
      TQFP
      CASE 983A–01
      3/16/98
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