參數資料
型號: MCIMX31DVMN5DR2
廠商: Freescale Semiconductor
文件頁數: 23/118頁
文件大?。?/td> 0K
描述: IC MPU I.MX31 CONSUMR 473MAPBGA
標準包裝: 750
系列: i.MX31
核心處理器: ARM11
芯體尺寸: 32-位
速度: 532MHz
連通性: 1 線,ATA,EBI/EMI,F(xiàn)IR,I²C,MMC/SD,PCMCIA,SIM,SPI,SSI,UART/USART,USB,USB OTG
外圍設備: DMA,LCD,POR,PWM,WDT
程序存儲器類型: ROMless
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.22 V ~ 3.3 V
振蕩器型: 外部
工作溫度: 0°C ~ 70°C
封裝/外殼: 473-LFBGA
包裝: 帶卷 (TR)
MCIMX31/MCIMX31L Technical Data, Rev. 4.3
12
Freescale Semiconductor
Electrical Characteristics
NOTES
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
Thermal test board meets JEDEC specification for this package.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
meets JEDEC specification for the specified package.
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
5. Thermal characterization parameter indicating the temperature difference between the package
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
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