參數(shù)資料
型號(hào)： MCF5274VM166
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 166 MHz, RISC PROCESSOR, PBGA256
封裝： ROHS COMPLIANT, PLASTIC, MAPBGA-256
文件頁(yè)數(shù)： 38/44頁(yè)
文件大小： 980K
代理商： MCF5274VM166
Documentation
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Freescale Semiconductor
43
9
Documentation
Documentation regarding the MCF5275 and their development support tools is available from a local
Freescale distributor, a Freescale semiconductor sales office, the Freescale Literature Distribution Center,
or through the Freescale web address at http://www.freescale.com/coldfire.
10
Revision History
Table 29 provides a revision history for this hardware specification.
Table 29. Document Revision History
Rev. No.
Substantive Change(s)
0
Initial release.
1
Added Figure 6.
1.1
Removed duplicate information in the module description sections. The information is all in the Signals
Description Table.
1.2
Removed Overview, Features, Signal Descriptions, Modes of Operation, and Address Multiplexing sections. This
information can be found in the MCF5275 Reference Manual.
Removed list of documentation in Section 9, “Documentation.”. An up-to-date list is always available on our web
site.
Changed CLKOUT -> PSTCLK in Section 8.16, “Debug AC Timing Specifications.”
Table 10: Update VDD spec from 1.35-1.65 to 1.4-1.6.
Table 13: Timings B6a, B6b, B6c, B7, B7a, B9, B12 updated:
B6a, B6b, B6c maximum changed from “0.5tCYC + 5” to “0.5tCYC +5.5”
B7, B7a minimum changed from “0.5tCYC + 1.5” to “0.5tCYC +1.0”
B9, B11 minimum changed from “1.5” to “1.0”
1.3
Added thermal characteristics for 196 MAPBGA in Table 8.
Updated package dimensions drawing, Figure 6.
2
FECn_TXEN, FECn_TXER, FECn_TXCLK),” regarding no minimum frequency requirement for TXCLK.
Removed third and fourth paragraphs from Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
FECn_TXEN, FECn_TXER, FECn_TXCLK),” as this feature is not supported on this device.
3
Corrected Ordering Information, Table 6.
Figure 2: Moved PLLVDD from 1.5V to 3.3V supply line and corrected relevant text in sections below table.
Table 10: Corrected maximum “Input High Voltage 3.3V I/O Pads”, VIH specification.
4
Table 10, added PLL supply voltage row
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
M5275EVB,
MCF5274CVM166,
MCF5274LCVM166,
MCF5274LVM166,
MCF5274VM166,
MCF5275CVM166,
MCF5275LCVM166
相關(guān)PDF資料
PDF描述
MCF5275LCVM133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA196
MCF5275CVM133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256
MCF5274VM133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256
MCF5280CVF80 FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA256
MCF5281CVM80 FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5274VM166J 制造商:Freescale Semiconductor 功能描述:MCF5274 V2CORE 64KSRAM - Bulk
MCF5275 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Family Hardware Specification
MCF5275CVM133 功能描述:IC MCU 32BIT 133MHZ 256-MAPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MCF527x 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MCF5275CVM166 功能描述:微處理器 - MPU MCF5275 V2CORE 64KSRAM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5275CVM166 制造商:Freescale Semiconductor 功能描述:Microprocessor IC
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