參數(shù)資料
型號(hào): MCF5251_07
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: ColdFire㈢ Microprocessor Data Sheet
中文描述: ㈢的ColdFire微處理器的數(shù)據(jù)資料
文件頁(yè)數(shù): 24/32頁(yè)
文件大?。?/td> 299K
代理商: MCF5251_07
Package Information and Pinout
MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2.2
24
Freescale Semiconductor
5.2
Package Drawing
Figure 5
shows the package outline diagram for the MCF5251 processor.
Figure 5. MCF5251 Package Drawing
BOTTOM VIEW
SIDE VIEW
TOP VIEW
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing per ASME Y14. 5M–1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crown of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
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