參數(shù)資料
型號(hào): MCF52223CVM66
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA81
封裝: 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81
文件頁(yè)數(shù): 24/55頁(yè)
文件大?。?/td> 980K
代理商: MCF52223CVM66
Electrical Characteristics
MCF52223 ColdFire Microcontroller, Rev. 3
Freescale Semiconductor
30
2.3
Thermal Characteristics
Table 24 lists thermal resistance values.
Table 24. Thermal Characteristics
Characteristic
Symbol
Value
Unit
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
531,2
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
391,3
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
421,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
331,3
C/W
Junction to board
JB
254
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
C/W
Junction to case
JC
95
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
Tj
105
oC
81 MAPBGA Junction to ambient, natural convection
Single layer board (1s)
JA
611,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
352,3
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
502,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
312,3
C/W
Junction to board
JB
204
C/W
Junction to case
JC
125
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
Tj
105
oC
64 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
621,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
431,3
C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
JMA
501,3
C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
JMA
361,3
C/W
Junction to board
JB
264
C/W
Junction to case
JC
95
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
Tj
105
oC
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