參數(shù)資料
型號： MC9S12DJ256CFU
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Microcontroller Unit (MCU)
中文描述： 微控制器（MCU）
文件頁數(shù)： 106/130頁
文件大小： 2460K
代理商： MC9S12DJ256CFU
MC9S12DT256 Device User Guide V03.03
104
A.3.1.3 Sector Erase
Erasing a 512 byte Flash sector or a 4 byte EEPROM sector takes:
The setup time can be ignored for this operation.
A.3.1.4 Mass Erase
Erasing a NVM block takes:
The setup time can be ignored for this operation.
A.3.1.5 Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the
location
of the
first non-blank word starting at relative address zero. It takes one bus cycle per word to verify plus a setup
of the command.
Table A-11 NVM Timing Characteristics
Conditions are shown in
Table A-4
unless otherwise noted
Num C
Rating
Symbol
Min
Typ
Max
Unit
1
D External Oscillator Clock (MC9S12DT256C< V, M)
f
NVMOSC
0.5
50
1
NOTES
:
1. Restrictions for oscillator in crystal mode apply!
2. Minimum Programming times are achieved under maximum NVM operating frequency f
NVMOP
and maximum bus frequency
f
bus
.
MHz
2
D Bus frequency for Programming or Erase Operations
f
NVMBUS
1
MHz
3
D Operating Frequency
f
NVMOP
150
200
kHz
4
P Single Word Programming Time
t
swpgm
46
2
74.5
3
μ
s
5
D Flash Burst Programming consecutive word
4
t
bwpgm
20.4
2
31
3
μ
s
6
D Flash Burst Programming Time for 32 Words
4
t
brpgm
1331.2
2
2027.5
3
μ
s
7
P Sector Erase Time
t
era
20
5
26.7
3
ms
8
P Mass Erase Time
t
mass
100
5
133
3
ms
9
D Blank Check Time Flash per block
t
check
11
6
65546
7
t
cyc
10
D Blank Check Time EEPROM per block
t
check
11
6
2058
7
t
cyc
t
era
4000
1
f
NVMOP
---------------------
≈
t
mass
20000
1
f
NVMOP
---------------------
≈
t
check
location t
cyc
10 t
cyc
+
≈
F
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC9S12DP256CCPV device made up of standard HCS12 blocks and the HCS12 processor core
MC9S12DP256CMFU device made up of standard HCS12 blocks and the HCS12 processor core
MC9S12DP256CVFU device made up of standard HCS12 blocks and the HCS12 processor core
MC9S12DT256B device made up of standard HCS12 blocks and the HCS12 processor core
MPXV5004DP Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，帶片內(nèi)信號調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC9S12DJ256CFUE 功能描述:16位微控制器 - MCU BARRACUDA4 L01Y EPP RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MC9S12DJ256CFUE 制造商:Freescale Semiconductor 功能描述:IC, 16BIT MICROCONTROLLER
MC9S12DJ256CPV 制造商:Rochester Electronics LLC 功能描述: 制造商:Freescale Semiconductor 功能描述:
MC9S12DJ256CPVE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 L01Y RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MC9S12DJ256MFUE 功能描述:16位微控制器 - MCU BARRACUDA4 L01Y EPP RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*