
Appendix A Electrical Characteristics
MC9S08SG8 MCU Series Data Sheet, Rev. 6
Freescale Semiconductor
311
A.13
FLASH Specications
This section provides details about program/erase times and program-erase endurance for the FLASH
memory.
Program and erase operations do not require any special power sources other than the normal VDD supply.
For more detailed information about program/erase operations, see the Memory section.
Table A-16. FLASH Characteristics
Num
C
Characteristic
Symbol
Min
Typical
Max
Unit
1
—
Supply voltage for program/erase
Vprog/erase
2.7
5.5
V
2
—
Supply voltage for read operation
VRead
2.7
5.5
V
3
—
Internal FCLK frequency1
1
The frequency of this clock is controlled by a software setting.
fFCLK
150
200
kHz
4
—
Internal FCLK period (1/fFCLK)tFcyc
5
6.67
μs
5
—
Byte program time (random location)2
2 These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
tprog
9tFcyc
6
—
Byte program time (burst mode)2
tBurst
4tFcyc
7
—
Page erase time2
tPage
4000
tFcyc
8
—
Mass erase time2
tMass
20,000
tFcyc
9C
Program/erase endurance3
TL to TH = –40°C to +125°C
T = 25
°C
3 Typical endurance for FLASH is based on the intrinsic bit cell performance. For additional information on how Freescale
denes typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory.
nFLPE
10,000
—
100,000
—
cycles
10
C
Data retention4
4 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25
°C using the Arrhenius equation. For additional information on how Freescale denes typical data retention, please refer
to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
tD_ret
15
100
—
years