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| 型號： | MC9S08QA2CFQE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 29/32頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 8BIT 2K FLASH 8-DFN |
| 產(chǎn)品培訓(xùn)模塊： | 8-Bit Microcontroller Overview |
| 標(biāo)準(zhǔn)包裝： | 490 |
| 系列： | S08 |
| 核心處理器： | S08 |
| 芯體尺寸： | 8-位 |
| 速度： | 20MHz |
| 外圍設(shè)備： | LVD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 4 |
| 程序存儲器容量： | 2KB（2K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 160 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 4x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-VDFN 裸露焊盤 |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 728 (CN2011-ZH PDF) |
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MC9S08QA4 Series MCU Data Sheet, Rev. 3
Electrical Characteristics
Freescale Semiconductor
6
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
—TA = Ambient temperature, °C
—
θJA = Package thermal resistance, junction-to-ambient, °C/W
—PD = Pint + PI/O
—Pint = IDD × VDD, Watts — chip internal power
—PI/O = Power dissipation on input and output pins — user-determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
3.4
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits,
normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure
that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During
the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the
charge device model (CDM).
Table 3. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
°C
Thermal resistance
Single-layer board
8-pin PDIP
θ
JA
113
°C/W
8-pin NB SOIC
150
8-pin DFN
179
Thermal resistance
Four-layer board
8-pin PDIP
θ
JA
72
°C/W
8-pin NB SOIC
87
8-pin DFN
41
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC9S08QA2CFQE | 制造商:Freescale Semiconductor 功能描述:IC 8BIT MCU HCS08 20MHZ DFN-8 |
| MC9S08QA2CFQEE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Technical Data |
| MC9S08QA2CPAE | 功能描述:8位微控制器 -MCU 9S08QA4 - CI RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| MC9S08QA2CPAE | 制造商:Freescale Semiconductor 功能描述:IC 8BIT MCU HCS08 20MHZ DIP-8 |
| MC9S08QA4 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:8-bit HCS08 Central Processor Unit (CPU) |
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