
FLASH Specications
MC9S08GB/GT Data Sheet, Rev. 2.3
Freescale Semiconductor
279
A.10
FLASH Specications
This section provides details about program/erase times and program-erase endurance for the FLASH
memory.
Program and erase operations do not require any special power sources other than the normal VDD supply.
Table A-13. FLASH Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Supply voltage for program/erase
Vprog/erase
2.1
3.6
V
Supply voltage for read operation
0 < fBus < 8 MHz
0 < fBus < 20 MHz
VRead
1.8
2.08
3.6
V
Internal FCLK frequency1
1 The frequency of this clock is controlled by a software setting.
fFCLK
150
200
kHz
Internal FCLK period (1/FCLK)
tFcyc
5
6.67
s
Byte program time (random location)(2)
tprog
9
tFcyc
Byte program time (burst mode)(2)
tBurst
4
tFcyc
Page erase time2
2 These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
tPage
4000
tFcyc
Mass erase time(2)
tMass
20,000
tFcyc
Program/erase endurance3
TL to TH = –40°C to + 85°C
T = 25
°C
3 Typical endurance for FLASH was evaluated for this product family on the 9S12Dx64. For additional
information on how Freescale Semiconductor denes typical endurance, please refer to Engineering Bulletin
EB619/D, Typical Endurance for Nonvolatile Memory.
10,000
100,000
—
cycles
Data retention4
4 Typical data retention values are based on intrinsic capability of the technology measured at high temperature
and de-rated to 25
°C using the Arrhenius equation. For additional information on how Freescale Semiconductor
denes typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for
Nonvolatile Memory.
tD_ret
15
100
—
years