
Appendix A Electrical Characteristics
MC9S08DN60 Series Data Sheet, Rev 3
Freescale Semiconductor
329
A.13
Flash and EEPROM
This section provides details about program/erase times and program-erase endurance for the Flash and
EEPROM memory.
Program and erase operations do not require any special power sources other than the normal VDD supply.
Table A-16. Flash and EEPROM Characteristics
Num
C
Rating
Symbol
Min
Typical
Max
Unit
1
—
Supply voltage for program/erase
Vprog/erase
2.7
5.5
V
2—
Supply voltage for read operation
0 < fBus < 8 MHz
0<fBus < 20 MHz
VRead
2.7
5.5
V
3—
Internal FCLK frequency1
1 The frequency of this clock is controlled by a software setting.
fFCLK
150
200
kHz
4
—
Internal FCLK period (1/FCLK)
tFcyc
5
6.67
μs
5—
Byte program time (random location)(2)
tprog
9
tFcyc
6—
Byte program time (burst mode)(2)
tBurst
4
tFcyc
7—
Page erase time2
2 These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
tPage
4000
tFcyc
8—
Mass erase time(2)
tMass
20,000
tFcyc
9C
Flash Program/erase endurance3
TL to TH = –40°C to + 125°C
T = 25
°C
3 Typical endurance for Flash and EEPROM is based on the intrinsic bit cell performance. For additional information on how
Freescale Semiconductor denes typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for
Nonvolatile Memory.
nFLPE
10,000
—
100,000
—
cycles
10
C
EEPROM Program/erase endurance3
TL to TH = –40°C to + 0°C
TL to TH = 0°C to + 125°C
T = 25
°C
nEEPE
10,000
50,000
—
100,000
—
cycles
11
C
Data retention4
4 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25
°C using the Arrhenius equation. For additional information on how Freescale Semiconductor denes typical data
retention, please refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
tD_ret
15
100
—
years