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參數(shù)資料
| 型號： | MC9RS08LE4CWL |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 26/28頁 |
| 文件大小： | 0K |
| 描述： | MCU 8BIT 4K FLASH W/LCD 28-SOIC |
| 標(biāo)準(zhǔn)包裝： | 26 |
| 系列： | RS08 |
| 核心處理器： | RS08 |
| 芯體尺寸： | 8-位 |
| 速度： | 20MHz |
| 連通性： | SCI |
| 外圍設(shè)備： | LCD，LVD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 26 |
| 程序存儲器容量： | 4KB（4K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 256 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 包裝： | 管件 |
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ESD Protection and Latch-Up Immunity
MC9RS08LE4 MCU Data Sheet, Rev. 3
Freescale Semiconductor
7
The average chip-junction temperature (TJ) in
°C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C /W
PD = Pint + PI/O
Pint = IDD × VDD, Watts chip internal power
PI/O = Power dissipation on input and output pins user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA× (PD)2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations 1 and 2 iteratively for any value of TA.
3.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
105
°C
Thermal resistance
Single layer board 28-pin SOIC
θJA
70
°C/W
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