A pin is an external physical connection. The same pin can b" />
參數(shù)資料
型號(hào)： MC9328MXLVM20
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 34/90頁(yè)
文件大?。?/td> 0K
描述： IC MCU I.MX 200MHZ 256-MAPBGA
標(biāo)準(zhǔn)包裝： 152
系列： i.MXL
核心處理器： ARM9
芯體尺寸： 32-位
速度： 200MHz
連通性： EBI/EMI，I²C，MMC/SD，SPI，SSI，UART/USART，USB
外圍設(shè)備： DMA，I²S，LCD，POR，PWM，WDT
輸入/輸出數(shù)： 97
程序存儲(chǔ)器類型： ROMless
電壓 - 電源 (Vcc/Vdd)： 1.7 V ~ 3.3 V
振蕩器型： 外部
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-LFBGA
包裝： 托盤
Signals and Connections
MC9328MXL Technical Data, Rev. 8
4
Freescale Semiconductor
A pin is an external physical connection. The same pin can be used to connect a number of signals.
Asserted
means that a discrete signal is in active logic state.
— Active low signals change from logic level one to logic level zero.
— Active high signals change from logic level zero to logic level one.
Negated
means that an asserted discrete signal changes logic state.
— Active low signals change from logic level zero to logic level one.
— Active high signals change from logic level one to logic level zero.
LSB means least significant bit or bits, and MSB means most significant bit or bits. References to
low and high bytes or words are spelled out.
Numbers preceded by a percent sign (%) are binary. Numbers preceded by a dollar sign ($) or 0x
are hexadecimal.
2
Signals and Connections
Table 2 identifies and describes the i.MXL processor signals that are assigned to package pins. The signals
are grouped by the internal module that they are connected to.
Table 2. i.MXL Signal Descriptions
Signal Name
Function/Notes
External Bus/Chip-Select (EIM)
A[24:0]
Address bus signals
D[31:0]
Data bus signals
EB0
MSB Byte Strobe—Active low external enable byte signal that controls D [31:24].
EB1
Byte Strobe—Active low external enable byte signal that controls D [23:16].
EB2
Byte Strobe—Active low external enable byte signal that controls D [15:8].
EB3
LSB Byte Strobe—Active low external enable byte signal that controls D [7:0].
OE
Memory Output Enable—Active low output enables external data bus.
CS [5:0]
Chip-Select—The chip-select signals CS [3:2] are multiplexed with CSD [1:0] and are selected by the
Function Multiplexing Control Register (FMCR). By default CSD [1:0] is selected.
ECB
Active low input signal sent by a flash device to the EIM whenever the flash device must terminate an
on-going burst sequence and initiate a new (long first access) burst sequence.
LBA
Active low signal sent by a flash device causing the external burst device to latch the starting burst
address.
BCLK (burst clock)
Clock signal sent to external synchronous memories (such as burst flash) during burst mode.
RW
RW signal—Indicates whether external access is a read (high) or write (low) cycle. Used as a WE input
signal by external DRAM.
DTACK
DTACK signal—The external input data acknowledge signal. When using the external DTACK signal
as a data acknowledge signal, the bus time-out monitor generates a bus error when a bus cycle is not
terminated by the external DTACK signal after 1022 clock counts have elapsed.
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MC9328MXLVM20 制造商:Freescale Semiconductor 功能描述:Microprocessor
MC9328MXLVM20R2 功能描述:處理器 - 專門應(yīng)用 DRAGONBALL CORSICA PB-FR RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MC9328MXLVP15 功能描述:處理器 - 專門應(yīng)用 DRAGONBALL MXL 225 PB-FR RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MC9328MXLVP15 制造商:Freescale Semiconductor 功能描述:Microprocessor
MC9328MXLVP15R2 功能描述:處理器 - 專門應(yīng)用 DRAGONBALL MXL 225 PB-FR RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
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