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參數(shù)資料
| 型號： | MC8641DVU1250HC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 16/130頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU DUAL E600 CORE 1023FCCBGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | MPC86xx |
| 處理器類型： | 32-位 MPC86xx PowerPC |
| 速度： | 1.25GHz |
| 電壓： | 1.05V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 1023-BCBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 1023-FCCBGA（33x33） |
| 包裝： | 托盤 |
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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
112
Freescale Semiconductor
Thermal
19.2.2
Thermal Interface Materials
A thermal interface material is recommended at the package-to-heat sink interface to minimize the thermal
contact resistance. Figure 61 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 59). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC8641. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 61. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spec
if
ic
Ther
m
a
lResi
st
ance
(K
-i
n.
2
/W
)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC8641DVU1250HB | IC MPU DUAL E600 CORE 1023FCCBGA |
| 345-010-542-801 | CARDEDGE 10POS DUAL .100 GREEN |
| 345-010-542-204 | CARDEDGE 10POS DUAL .100 GREEN |
| 345-010-542-202 | CARDEDGE 10POS DUAL .100 GREEN |
| 2-84982-0 | CONN FFC 20POS 1.00MM VERT SMD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8641DVU1250J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DVU1250K | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DVU1250N | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DVU1333CJE | 制造商:Freescale Semiconductor 功能描述:G8,REV3,0.95V,105C - Trays |
| MC8641DVU1333G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
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