參數(shù)資料
型號： MC8640DVU1067NE
廠商： Freescale Semiconductor
文件頁數(shù)： 18/130頁
文件大?。?/td> 0K
描述： IC MPU DUAL CORE E600 1023FCCBGA
標準包裝： 1
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.067GHz
電壓： 0.95V
安裝類型： 表面貼裝
封裝/外殼： 1023-BCBGA，F(xiàn)CCBGA
供應商設備封裝： 1023-FCCBGA（33x33）
包裝： 托盤
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
114
Freescale Semiconductor
Thermal
The thermal model uses approximate dimensions to reduce grid. Please refer to the case outline for actual
dimensions.
Figure 62. Recommended Thermal Model of MPC8640
19.2.4
Temperature Diode
The MPC8640 has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the VBE variation of each MPC8640’s internal diode.
The following are the specifications of the MPC8640 on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA at 125
°C
Ideality factor over 5–150
μA at 60 °C: n = 1.0275 ± 0.9%
Bump and Underfill
Die
Substrate
C5 solder layer
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Die (12.4
× 15.3 × 0.86 mm)
Silicon
Temperature
dependent
Bump and Underfill (12.4
× 15.3 × 0.07 mm)
Collapsed Resistance
kz
5.3
W/(m K)
Substrate (33
× 33 × 1.2 mm)
kx
13.5
W/(m K)
ky
13.5
kz
5.3
C5 Solder layer (33
× 33 × 0.4 mm)
kx
0.034
W/(m K)
ky
0.034
kz
9.6
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