參數(shù)資料
型號(hào): MC850DECVR50BUR2
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 60/72頁(yè)
文件大?。?/td> 0K
描述: IC MPU PQUICC 50MHZ 256-PBGA
標(biāo)準(zhǔn)包裝: 500
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 50MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 帶卷 (TR)
MPC850 PowerQUICC Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
63
Mechanical Data and Ordering Information
9
Mechanical Data and Ordering Information
Table 26 provides information on the MPC850 derivative devices.
Table 27 identifies the packages and operating frequencies available for the MPC850.
9.1
Pin Assignments and Mechanical Dimensions of the PBGA
The original pin numbering of the MPC850 conformed to a Freescale proprietary pin numbering scheme
that has since been replaced by the JEDEC pin numbering standard for this package type. To support
Table 26. MPC850 Family Derivatives
Device
Ethernet Support
Number of SCCs 1
1
Serial Communication Controller (SCC)
32-Channel HDLC
Support
64-Channel HDLC
Support 2
2
50 MHz version supports 64 time slots on a time division multiplexed line using one SCC
MPC850
N/A
One
N/A
MPC850DE
Yes
Two
N/A
MPC850SR
Yes
Two
N/A
Yes
MPC850DSL
Yes
Two
No
Table 27. MPC850 Package/Frequency/Availability
Package Type
Frequency (MHz)
Temperature (Tj)
Order Number
256-Lead Plastic Ball Grid Array
(ZT suffix)
50
0°C to 95°C
XPC850ZT50BU
XPC850DEZT50BU
XPC850SRZT50BU
XPC850DSLZT50BU
66
0°C to 95°C
XPC850ZT66BU
XPC850DEZT66BU
XPC850SRZT66BU
80
0°C to 95°C
XPC850ZT80BU
XPC850DEZT80BU
XPC850SRZT80BU
256-Lead Plastic Ball Grid Array
(CZT suffix)
50
-40°C to 95°C
XPC850CZT50BU
XPC850DECZT50BU
XPC850SRCZT50BU
XPC850DSLCZT50BU
66
XPC850CZT66BU
XPC850DECZT66BU
XPC850SRCZT66BU
80
XPC850CZT80B
XPC850DECZT80B
XPC850SRCZT80B
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MC850DECZQ50BUR2 功能描述:微處理器 - MPU POWERPC MPU W/CPM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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