參數(shù)資料
型號: MC74VHC1GT126
廠商: ON SEMICONDUCTOR
英文描述: Noninverting Buffer / CMOS Logic Level Shifter(非反相緩沖器)
中文描述: 同相緩沖/ CMOS邏輯電平轉(zhuǎn)換器(非反相緩沖器)
文件頁數(shù): 2/8頁
文件大小: 104K
代理商: MC74VHC1GT126
MC74VHC1GT126
http://onsemi.com
2
MAXIMUM RATINGS
(Note 1)
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
PD
DC Supply Voltage
–0.5 to +7.0
V
DC Input Voltage
–0.5 to +7.0
V
DC Output Voltage
–0.5 to VCC + 0.5
–20
V
Input Diode Current
mA
Output Diode Current
VOUT < GND; VOUT > VCC
+20
mA
DC Output Current, per Pin
+25
mA
DC Supply Current, VCC and GND
Power dissipation in still air
+50
mA
SC–88A, TSOP–5
200
mW
JA
TL
TJ
Tstg
VESD
Thermal resistance
SC–88A, TSOP–5
333
C/W
Lead temperature, 1 mm from case for 10 s
260
°
C
Junction temperature under bias
+150
°
C
Storage temperature
–65 to +150
°
C
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILatch–Up
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
Latch–Up Performance
Above VCC and Below GND at 125
°
C (Note 5)
±
500
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
VIN
VOUT
TA
tr , tf
DC Supply Voltage
3.0
5.5
V
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
VCC
+125
V
Operating Temperature Range
–55
°
C
Input Rise and Fall Time
VCC = 5.0 V
±
0.5 V
0
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°
C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
TIME, YEARS
N
T
°
T
°
T
°
T
°
T
°
T
°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
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