參數(shù)資料
型號: MC74VHC1G132DTT1
廠商: ON SEMICONDUCTOR
元件分類: 通用總線功能
英文描述: 2-Input NAND Schmitt-Trigger
中文描述: AHC/VHC SERIES, 2-INPUT NAND GATE, PDSO5
封裝: SC-59, SOT-23, TSOP-5
文件頁數(shù): 2/6頁
文件大?。?/td> 72K
代理商: MC74VHC1G132DTT1
MC74VHC1G132
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
T
STG
T
L
T
J
DC Supply Voltage
0.5 to
7.0
V
DC Input Voltage
0.5 to +7.0
V
DC Output Voltage
0.5 to V
CC
20
0.5
V
DC Input Diode Current
mA
DC Output Diode Current
20
mA
DC Output Sink Current
12.5
mA
DC Supply Current per Supply Pin
25
mA
°
C
°
C
°
C
°
C/W
Storage Temperature Range
65 to
150
Lead Temperature, 1 mm from Case for 10 Seconds
260
Junction Temperature Under Bias
150
JA
Thermal Resistance
SC705/SC88A (Note 1)
TSOP5
350
230
P
D
Power Dissipation in Still Air at 85
°
C
SC705/SC88A
TSOP5
150
200
mW
MSL
Moisture Sensitivity
Level 1
F
R
V
ESD
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2000
200
N/A
V
I
LATCHUP
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
Latchup Performance
Above V
CC
and Below GND at 125
°
C (Note 5)
500
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
V
IN
V
OUT
T
A
t
r
, t
f
DC Supply Voltage
2.0
5.5
V
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
V
CC
125
V
°
C
ns/V
Operating Temperature Range
55
Input Rise and Fall Time
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
No Limit
No Limit
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature
°
C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
TIME, YEARS
N
T
°
T
°
T
°
T
°
T
°
T
°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
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