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參數(shù)資料
| 型號(hào)： | MC74LCX02 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | 15 A 12-V Input Bus Termination Power Module for DDR/QDR Memory 10-DIP MODULE -40 to 85 |
| 中文描述： | 低電壓CMOS四路2輸入或非門 |
| 文件頁數(shù)： | 5/7頁 |
| 文件大?。?/td> | 135K |
| 代理商： | MC74LCX02 |
MC74LCX02
LCX DATA
BR1339 — REV 3
5
MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
7
°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
7
°
0.244
0.019
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
–B
–
P 7 PL
G
C
K
SEATING
PLANE
D 14 PL
M
J
R X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
B
0.25 (0.010) M
M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
Z
D
HE
E
1
14
8
7
b
A1
A
e
L
DIM
MIN
MAX
MIN
MAX
INCHES
---
2.05
---
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.18
0.27
0.007
0.011
9.90
10.50
0.390
0.413
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
---
1.42
---
0.056
A1
A
b
c
D
E
e
L
M
Z
HE
Q1
LE
_ 10_
0
_ 10_
LE
Q1
c
M _
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M
0.10 (0.004)
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