參數(shù)資料
型號(hào): MC7457VG1000LC
廠商: Freescale Semiconductor
文件頁數(shù): 59/71頁
文件大?。?/td> 0K
描述: IC MPU RISC 1000MHZ 483FCCBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 1.0GHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 483-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 483-FCCBGA(29x29)
包裝: 托盤
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
System Design Information
Freescale Semiconductor
62
9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure and is recommended due to the high power dissipation of the MPC7457. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:
0
0.5
1
1.5
2
0
1020
304050
6070
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific
Th
er
ma
lResistance
(K-in.
2
/W
)
相關(guān)PDF資料
PDF描述
MC68040RC33V IC MICROPROCESSOR 32BIT 182-PGA
FH40-10S-0.5SV CONN FPC/FFC 10POS .5MM VERT SMD
MC68LC040RC40A IC MPU 32BIT 40MHZ 179-PGA
XPC8260CZUIHBC IC MPU POWERQUICC II 480-TBGA
XPC8260CVVIHBC IC MPU POWERQUICC II 480-TBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7457VG1000NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG733NC 功能描述:IC MPU RISC 733MHZ 483FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MC7457VG867NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC74A5-33SNTR 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel