
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
33
Package Description
8.5
Package Parameters for the MPC7448, 360 HCTE
RoHS-Compliant BGA
The package parameters are as provided in the following list. The package type is 25
× 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE) with RoHS-compliant lead-free
spheres.
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
1.92 mm
Maximum module height
2.40 mm
Ball diameter
0.75 mm (30 mil)
Coefficient of thermal expansion12.3 ppm/°C