參數(shù)資料
型號: MC7448THX1000ND
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360
文件頁數(shù): 22/66頁
文件大小: 793K
代理商: MC7448THX1000ND
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
29
Package Description
8
Package Description
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
Package Parameters for the MPC7448, 360 HCTE BGA
The package parameters are as provided in the following list. The package type is 25
× 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.32 mm
Maximum module height
2.80 mm
Ball diameter
0.89 mm (35 mil)
Coefficient of thermal expansion12.3 ppm/°C
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