參數(shù)資料
型號(hào)： MC7447RX1000NBR2
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
文件頁(yè)數(shù)： 57/87頁(yè)
文件大小： 1586K
代理商： MC7447RX1000NBR2
60
MPC7457 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
affect the final operating die-junction temperature—airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as system-level designs.
For system thermal modeling, the MPC7447 and MPC7457 thermal model is shown in Figure 28. Four
volumes will be used to represent this device. Two of the volumes, solder ball, and air and substrate, are
modeled using the package outline size of the package. The other two, die, and bump and underfill, have the
same size as the die. The silicon die should be modeled 9.64
× 11.0 × 0.74 mm with the heat source applied
as a uniform source at the bottom of the volume. The bump and underfill layer is modeled as 9.64
× 11.0 ×
0.69 mm (or as a collapsed volume) with orthotropic material properties: 0.6 W/(m K) in the xy-plane and
2 W/(m K) in the direction of the z-axis. The substrate volume is 25
× 25 × 1.2 mm (MPC7447) or 29 ×
29
× 1.2 mm (MPC7457), and this volume has 18 W/(m K) isotropic conductivity. The solder ball and air
layer is modeled with the same horizontal dimensions as the substrate and is 0.9 mm thick. It can also be
modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m K) in the xy-plane
direction and 3.8 W/(m K) in the direction of the z-axis.
Figure 30. Recommended Thermal Model of MPC7447 and MPC7457
Bump and Underfill
Die
Substrate
Solder and Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Bump and Underfill
kx
0.6
W/(m K)
ky
0.6
kz
2
Substrate
k18
Solder Ball and Air
kx
0.034
ky
0.034
kz
3.8
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