參數(shù)資料
型號: MC7447AVU867NB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360
文件頁數(shù): 20/58頁
文件大?。?/td> 1095K
代理商: MC7447AVU867NB
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
27
Package Description
8
Package Description
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
Package Parameters for the MPC7447A, 360 HCTE BGA
The package parameters are as provided in the following list. The package type is 25
× 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.72 mm
Maximum module height
3.24 mm
Ball diameter
0.89 mm (35 mil)
Coefficient of thermal expansion 12.3 ppm/°C
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