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參數(shù)資料
| 型號： | MC7447AVU733NB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 43/56頁 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 32BIT 360-BGA |
| 標準包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 733MHz |
| 電壓： | 1.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-BCBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
48
Freescale Semiconductor
System Design Information
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, and so on.
Due to the complexity and variety of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction)
may vary widely. For these reasons, we recommend using conjugate heat transfer models for the board, as
well as system-level designs.
For system thermal modeling, the MPC7447A thermal model is shown in Figure 24. Four volumes
represent this device. Two of the volumes, solder ball-air and substrate, are modeled using the package
outline size of the package. The other two, die and bump-underfill, have the same size as the die. The
silicon die should be modeled 8.5
× 9.9 × 0.7 mm3 with the heat source applied as a uniform source at the
bottom of the volume. The bump and underfill layer is modeled as 8.5
× 9.9 × 0.07 mm3 (or as a collapsed
volume) with orthotropic material properties: 0.6 W/(m K) in the xy-plane and 1.9 W/(m K) in the
direction of the z-axis. The substrate volume is 25
× 25 × 1.2 mm3, and has 8.1 W/(m K) isotropic
conductivity in the xy-plane and 4 W/(m K) in the direction of the z-axis. The solder ball and air layer
are modeled with the same horizontal dimensions as the substrate and are 0.6 mm thick. They can also be
modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m K) in the xy-plane
direction and 3.8 W/(m K) in the direction of the z-axis.
Figure 24. Recommended Thermal Model of MPC7447A
Bump and Underfill
Die
Substrate
Solder and Air
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Bump and Underfill (8.5
× 9.9 × 0.07 mm
3
)
kx
0.6
W/(m K)
ky
0.6
kz
1.9
Substrate (25
× 25 × 1.2 mm
3
)
kx
8.1
ky
8.1
kz
4.0
Solder Ball and Air (25
× 25 × 0.6 mm3)
kx
0.034
ky
0.034
kz
3.8
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| MC7447AVU867NB | 功能描述:微處理器 - MPU A7PM PB FREE SPHERES RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC7447RX1000LB | 制造商:Motorola Inc 功能描述: |
| MC7447RX1000NB | 制造商:Freescale Semiconductor 功能描述:IC, 32BIT MPU, 1000MHZ, BGA-360, Series:(Power) HOST MPU, Core Size:32bit, Progr |
| MC7447RX600NB | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB |
| MC7447RX733NB | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述: |
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