參數(shù)資料
型號: MC7447AHX733NB
廠商: Freescale Semiconductor
文件頁數(shù): 39/56頁
文件大?。?/td> 0K
描述: IC MPU RISC 32BIT 360-FCCBGA
標準包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 733MHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 360-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
44
Freescale Semiconductor
System Design Information
Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7447A. There are
several commercially-available heat sinks for the MPC7447A provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
401-732-8100
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
717-564-0100
Chip Coolers
P.O. Box 3608
Harrisburg, PA 17105-3608
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Thermal
Heat Sink
HCTE LGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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