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參數(shù)資料
| 型號： | MC72000 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | Integrated Bluetooth Radio |
| 中文描述： | 集成藍牙無線 |
| 文件頁數(shù)： | 1/156頁 |
| 文件大?。?/td> | 1782K |
| 代理商： | MC72000 |
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MC72000
Ordering Information
Device
Operating
Temperature Range
Package
MC72000
-40° C to 85° C
MAPBGA – 100
Package Information
Plastic Package
Case 1398-01
(MAPBGA–100)
This document contains information on a new product. Specifications and information herein are subject to change
without notice. Motorola, Inc., 2003. All rights reserved.
Preliminary
For More Information On This Product,
Go to: www.freescale.com
The MC72000 Integrated Bluetooth Radio provides a complete, low-power Bluetooth
radio solution. The design is based on Motorola’s third-generation Bluetooth architecture
that has set a high standard for interoperability, complete functionality, and compliance with
the Bluetooth specification.
The MC72000 Integrated Bluetooth Radio from Motorola implements the RF and baseband
host controller interface (HCI) of the Bluetooth protocol in a small 7 mm x 7 mm BGA
package. The MC72000 is the ideal solution for low-power, short-range Bluetooth
applications with small size constraints and includes superior performance features like a
dedicated Bluetooth audio processor module and on-chip memory. Debug and production
test are fully supported through the joint test action group (JTAG) interface.
The RF portion of the radio provides a unique combination of high sensitivity, excellent C/I
performance, and low power consumption. These performance parameters are extremely
important to maintaining a robust link in high RF interference environments created by
devices such as mobile phones, high density Bluetooth networks, 802.11b networks, and
microwave ovens.
The MC72000 uses an innovative, highly advanced packaging technique to combine two
die—the RF and baseband functions—into a single, cost-effective package. Motorola’s
optimized two-chip architecture avoids compromises between cost and performance that
other one-chip solutions must make. With Motorola’s integrated solution, customers get the
best of both. Each die is implemented in its optimal process technology to deliver low cost,
low power, and small size.
Advance Information
Data Sheet
MC72000/D
Rev. 2.6, 1/2003
MC72000 Integrated
Bluetooth Radio
Contents
1 MC72000 Features . . . . 2
2 System Overview. . . . . . 3
3 Electrical
Characteristics. . . . . . . . 4
4 Package Pinout . . . . . . 17
5 System Description. . . 27
6 Radio Functional
Description. . . . . . . . . . 31
7 Hardware Functional
Description. . . . . . . . . . 49
8 Bluetooth Baseband
Functionality
Overview. . . . . . . . . . . 126
9 HCI Features. . . . . . . . 134
10 Applications
Information. . . . . . . . . 139
11 Application Example
Evaluation Printed Circuit
Boards . . . . . . . . . . . . 150
12 Mechanical Outline
(Package
Information) . . . . . . . . 151
Appendix A: Radio
Register Map . . . . . . . 152
F
Freescale Semiconductor, Inc.
n
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