參數資料
型號: MC68HC705X4DWR2
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, OTPROM, 2.2 MHz, MICROCONTROLLER, PDSO28
封裝: PLASTIC, SOIC-28
文件頁數: 32/168頁
文件大?。?/td> 656K
代理商: MC68HC705X4DWR2
Electrical Characteristics
Thermal characteristics and power considerations
MC68HC05X4 Rev 1.0
MOTOROLA
Electrical Characteristics
127
where:
TA = Ambient temperature (°C)
θ
JA = Package thermal resistance, junction-to-ambient (°C/W)
PD = PINT + PI/O (W)
PINT = Internal chip power = IDD VDD (W)
PI/O = Power dissipation on input and output pins (user determined)
An approximate relationship between PD and TJ (if PI/O is neglected) is:
Solving equations [1] and [2] for K gives:
where K is a constant for a particular part. K can be determined by
measuring PD (at equilibrium) for a known TA. Using this value of K, the
values of PD and TJ can be obtained for any value of TA by solving the
above equations. The package thermal characteristics are shown in
Table 1.
[1]
[2]
[3]
Figure 2. Equivalent test load
T
J
T
A
P
D
θ
JA
()
+
=
P
D
K
T
J
273
+
-----------------------
=
KP
D
T
A
273
+
()
θ
JA
P
D
2
+
=
VDD = 4.5 V
R2
R1
C
Test
point
Pins
R1
R2
C
PA0–7, PB0–7
3.26k
2.38k 50pF
TX0, TX1
0.25k
0.25k 50pF
3-elec
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