參數(shù)資料
型號(hào)： MC68EC030RP25C
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, MICROPROCESSOR, PPGA117
封裝： PLASTIC, PGA-117
文件頁(yè)數(shù)： 13/48頁(yè)
文件大小： 332K
代理商： MC68EC030RP25C
2 0
MC68EC030 TECHNICAL DATA
MOTOROLA
ELECTRICAL SPECIFICATIONS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Voltage
VCC
-0.3 to +7.0
V
Input Voltage
Vin
-0.5 to +7.0
V
Operating Temperature Range
Minimum Ambient Temperature
Maximum Ambient Temperature
TA
0
70
°C
Storage Temperature Range
Tstg
-55 to 150
°C
THERMAL CHARACTERISTICS-- PGA PACKAGE
Characteristic
Symbol
Value Rating
Thermal Resistance - Plastic
Junction to Ambient
Junction to case
θ
JA
θ
JC
32
TBD
oC/W
POWER CONSIDERATIONS
The average chip-junction temperature, TJ, in
oC can be obtained from:
TJ=TA+(PD
θJA)
(1)
where:
TA
= Ambient Temperature,
oC
θJA
= Package Thermal Resistance, Junction-to-Ambient,
oC/W
PD
= PINT + PI/O
PINT
= ICC X VCC, Watts — Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications, PI/O<PINT and can be neglected.
The following is an approximate relationship between PD and TJ (if PI/O is neglected):
PD=K ÷ (TJ+273
oC)
(2)
Solving Equations (1) and (2) for K gives:
K=PD (TA + 273
oC) +
θJAPD2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by
measuring PD (at thermal equilibrium) for a known TA. Using this value of K, the values of PD and TJ can
be obtained by solving equations (1) and (2) iteratively for any value of TA.
The device contains circuitry
to
protect the inputs against damage
due to high
static
voltages
or
electric
fields;
however,
normal
precautions should be taken to
avoid application of voltages higher
than maximum-rated voltages to
these
high-impedance
circuits.
Tying
unused
inputs
to
the
appropriate logic voltage level (e.g.,
either
GND or VCC) enhances
reliability of operation.
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