參數(shù)資料
型號： MC56F8355VFGE
廠商： Freescale Semiconductor
文件頁數(shù)： 63/172頁
文件大?。?/td> 0K
描述： IC DSP 16BIT 60MHZ 128-LQFP
標準包裝： 72
系列： 56F8xxx
核心處理器： 56800E
芯體尺寸： 16-位
速度： 60MHz
連通性： CAN，EBI/EMI，SCI，SPI
外圍設備： POR，PWM，溫度傳感器，WDT
輸入/輸出數(shù)： 49
程序存儲器容量： 264KB（132K x 16）
程序存儲器類型： 閃存
RAM 容量： 10K x 16
電壓 - 電源 (Vcc/Vdd)： 2.25 V ~ 3.6 V
數(shù)據(jù)轉換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 105°C
封裝/外殼： 128-LQFP
包裝： 托盤
配用： MC56F8367EVME-ND - EVAL BOARD FOR MC56F83X
Power Consumption
56F8355 Technical Data, Rev. 17
Freescale Semiconductor
155
Preliminary
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two
of the IO cell types used on the device reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change. Table 10-24 provides coefficients for calculating power dissipated
in the IO cells as a function of capacitive load. In these cases:
TotalPower =
Σ((Intercept +Slope*Cload)*frequency/10MHz)
where:
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5
for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs driving
10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
Table 10-24 IO Loading Coefficients at 10MHz
Intercept
Slope
PDU08DGZ_ME
1.3
0.11mW / pF
PDU04DGZ_ME
1.15mW
0.11mW / pF
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相關代理商/技術參數(shù)
參數(shù)描述
MC56F8356 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:56F8356 16-bit Hybrid Controller
MC56F8356MFV60 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC56F8356MFVE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MC56F8356VFV60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MC56F8356VFVE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60MHz 60MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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