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FAST RECOVERY, HIGH POWER,
MICRO, HIGH VOLTAGE RECTIFIERS
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright
2004
12-29 2004 REV A
W
M
.
C
SCOTTSDALE DIVISION
MC5610 thru MC5619
M
DESCRIPTION
APPEARANCE
The MC5610 through MC5619 series of fast recovery high voltage silicon
rectifiers feature the smallest packages available. They are ideal for high-
reliability where a failure cannot be tolerated. These 0.275 to 0.790 Amp
rated rectifiers for working peak reverse voltages from 1500 to 5000 volts are
hermetically sealed with voidless-glass construction using an internal
“Category I” metallurgical bond. Typical applications include transmitters,
power supplies, radar equipment and X-ray machines. Surface mount MELF
package configurations are also available by adding “SM” suffix. Microsemi
also offers numerous other rectifier products to meet higher and lower
current ratings with various recovery time speed requirements including fast
and ultrafast device types in both through-hole and surface mount packages.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
Voidless Hermetically Sealed Glass Package
Triple-Layer Passivation
Internal “
Category I”
Metallurgical bonds
Lowest Reverse Leakage Available
Lowest Thermal Resistance Available
Absolute High Voltage / High Temperature Stability
Surface mount equivalents also available in a square
end-cap MELF configuration with “SM” suffix
High voltage fast recovery rectifiers 1500 to 5000 V
Military and other high-reliability applications
Applications include bridges, half-bridges, catch
diodes, voltage multipliers,
X-ray machines, power
supplies, transmitters, and radar equipment
High forward surge current capability
Extremely robust construction
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
Operating Temperature Range:
MC5610 – MC5612……-55
o
C to 150
o
C
MC5613 – MC5616……-65
o
C to 150
o
C
MC5617 – MC5619……-65
o
C to 125
o
C
Storage Temperature Range: -65
o
C to 175
o
C
Thermal Resistance: 38
o
C/W junction to lead at 3/8
inch (10 mm) lead length from body
Average Rectified Forward Current (I
O
): See
Electrical Characteristics for maximum rating at 55
o
C
and 100
C. Also see typical linear derating in Fig 1.
Forward Surge Current: See Electrical
Characteristics for surge at 8.3 ms half-sine wave
Solder Temperatures: 260oC for 10 s (maximum)
CASE: Hermetically sealed voidless hard glass with
Tungsten slugs
TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
MARKING: Body paint and part number, etc.
POLARITY: Cathode band
TAPE & REEL option: Standard per EIA-296
WEIGHT: 400 mg (approx)
See package dimensions on last page
S Package