MC4741C
6
MOTOROLA ANALOG IC DEVICE DATA
P SUFFIX
PLASTIC PACKAGE
CASE 646–06
ISSUE L
D SUFFIX
PLASTIC PACKAGE
CASE 751A–03
ISSUE F
(SO–14)
OUTLINE DIMENSIONS
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.300 BSC
0
0.015
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.62 BSC
0
0.39
0.095
0.015
0.135
2.41
0.38
3.43
10
10
1.01
0.039
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P
7 PL
14
8
7
1
M
0.25 (0.010)
B
M
S
B
M
0.25 (0.010)
A
S
T
–T–
SEATING
F
R
X 45
D
14 PL
K
C
J
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
0
5.80
0.25
MAX
8.75
4.00
1.75
0.49
1.25
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
0
0.228
0.010
MAX
0.344
0.157
0.068
0.019
0.049
INCHES
MILLIMETERS
0.25
0.25
7
6.20
0.50
0.009
0.009
7
0.244
0.019
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