參數(shù)資料
型號: MC33887PNBR2
廠商: MOTOROLA INC
元件分類: 運動控制電子
英文描述: 5.0 A H-Bridge with Load Current Feedback
中文描述: STEPPER MOTOR CONTROLLER, PQCC36
封裝: PLASTIC, QFN-36
文件頁數(shù): 4/28頁
文件大?。?/td> 485K
代理商: MC33887PNBR2
33887
4
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
D2
PGND
PGND
PGND
PGND
PGND
PGND
NC
28
27
26
25
24
23
22
21
2
3
4
5
6
7
8
9
1
1
1
1
1
1
1
1
3
3
3
3
3
3
3
2
IN2
EN
V+
V+
NC
D1
AGND
FS
NC
V
C
C
V
O
O
N
O
O
V
I
V
O
O
N
O
O
20
FB
19
NC
10
1
NC
Transparent Top View of Package
PQFN TERMINAL DEFINITIONS
A functional description of each terminal can be found in the System/Application Information section,
page 19
.
Terminal
Terminal
Name
Formal Name
Definition
1, 7, 10, 16,
19, 28, 31
NC
No Connect
No internal connection to this terminal.
2
D1
Disable 1
Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
3
IN2
Logic Input Control 2
Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
4
EN
Enable
Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
5, 6, 12, 13, 34, 35
V+
Positive Power Supply
Positive supply connections.
8
AGND
Analog Ground
Low-current analog signal ground.
9
FS
Fault Status for H-Bridge
Open drain active LOW Fault Status output requiring a pullup resistor to
5.0 V.
11
IN1
Logic Input Control 1
Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
14, 15, 17, 18
OUT1
H-Bridge Output 1
Output 1 of H-Bridge.
20
FB
Feedback for H-Bridge
Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
21–26
PGND
Power Ground
High-current power ground.
27
D2
Disable 2
Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
29, 30, 32, 33
OUT2
H-Bridge Output 2
Output 2 of H-Bridge.
36
C
CP
Charge Pump Capacitor
External reservoir capacitor connection for internal charge pump capacitor.
Pad
Thermal
Interface
Exposed Pad Thermal
Interface
Exposed pad thermal interface for sinking heat from the device.
Note
Must be DC-coupled to analog ground and power ground via very low
impedance path to prevent injection of spurious signals into IC substrate.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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