參數(shù)資料
型號(hào): MC33887DH
廠商: MOTOROLA INC
元件分類: 運(yùn)動(dòng)控制電子
英文描述: 5.0 A H-Bridge with Load Current Feedback
中文描述: STEPPER MOTOR CONTROLLER, PDSO20
封裝: PLASTIC, HSOP-20
文件頁(yè)數(shù): 7/28頁(yè)
文件大小: 485K
代理商: MC33887DH
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
7
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
(Note 8)
,
(Note 9)
,
(Note 10)
,
(Note 11)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JB
~5.0
~4.3
~8.0
°
C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
(Note 12)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JA
~41
~TBD
~62
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(Note 13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JMA
~30
~21.3
~TBD
°
C/W
Junction-to-Case (Exposed Pad)
(Note 14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JC
~0.5
~0.9
~1.5
°
C/W
Notes
8.
9.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die temperature
represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
θ
JC
-total must be less than 5.0 °C/W
for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-
883 Method 1012.1) with the cold plate temperature used for the case temperature.
10.
11.
12.
13.
14.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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MC33887DHR2 5.0 A H-Bridge with Load Current Feedback
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參數(shù)描述
MC33887DHR2 功能描述:IC H-BRIDGE 5A CURR FDBK 20-HSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 電機(jī)和風(fēng)扇控制器,驅(qū)動(dòng)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:直流電機(jī)驅(qū)動(dòng)器,步進(jìn)電機(jī)驅(qū)動(dòng)器 評(píng)估套件:- 輸出數(shù):1 或 2 電流 - 輸出:750mA 電壓 - 負(fù)載:10 V ~ 40 V 電源電壓:4.5 V ~ 5.5 V 工作溫度:-20°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-BFSOP(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:24-SOP 包裝:Digi-Reel® 其它名稱:MTS62C19A-HS105DKR
MC33887DWB 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 FIESTA 54 LD IC RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MC33887DWBR2 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 FIESTA 54 LD IC RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MC33887PEK 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CUR FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MC33887PEKR2 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 H-BRIDGE W/LD CUR FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube