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參數(shù)資料
| 型號(hào)： | MC33794DWB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 15/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SENSOR ELECTRIC FIELD 54-SOIC |
| 標(biāo)準(zhǔn)包裝： | 26 |
| 類型： | 傳感器接口 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 邏輯 |
| 接口： | ISO9141 |
| 電流 - 電源： | 7mA |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 54-BSSOP（0.295"，7.50mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 54-SOIC W EP |
| 包裝： | 管件 |
Sensors
6
Freescale Semiconductor
MC33794
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (1)
Machine Model (2)
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 85
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Resistance
Junction-to-Ambient (3)
Junction-to-Case (4)
Junction-to-Board (5)
RθJA
RθJC
RθJB
41
0.2
3.0
°C/W
Lead Soldering Temperature (for 10 Seconds)
TSOLDER
260
°C
Notes
1.
ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
2.
ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
3.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
4.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
5.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
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| MC33794DWBR2 | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測(cè)器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794EK | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應(yīng)方式:Optical 感應(yīng)距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風(fēng)格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
| MC33794EKR2 | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應(yīng)方式:Optical 感應(yīng)距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風(fēng)格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
| MC33797BPEW | 功能描述:功率驅(qū)動(dòng)器IC Four Channel Squib Dr RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| MC33797BPEWR2 | 功能描述:功率驅(qū)動(dòng)器IC Four Channel Squib Dr RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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