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參數資料
| 型號： | MC33794DH/R2 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 模擬信號調理 |
| 英文描述： | Electric Field Imaging Device |
| 中文描述： | SPECIALTY ANALOG CIRCUIT, PDSO44 |
| 封裝： | PLASTIC, HSOP-44 |
| 文件頁數： | 23/23頁 |
| 文件大?。?/td> | 574K |
| 代理商： | MC33794DH/R2 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
9
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 85
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Resistance
Junction-to-Ambient (Note 3)
Junction-to-Case (Note 4)
Junction-to-Board (Note 5)
RθJ-A
RθJ-C
RθJ-B
41
0.2
3.0
°C/W
Soldering Temperature (for 10 Seconds)
TSOLDER
260
°C
Notes
1.
ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
2.
ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
3.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87
and JEDEC JESD51-2 with the single layer board horizontal.
4.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
5.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
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相關代理商/技術參數 |
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| MC33794DWB | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關文件:Automotive Product Guide 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數字 輸出類型:數字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:20-TSSOP 包裝:管件 |
| MC33794DWBR2 | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關文件:Automotive Product Guide 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數字 輸出類型:數字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:20-TSSOP 包裝:管件 |
| MC33794EK | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應方式:Optical 感應距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
| MC33794EKR2 | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應方式:Optical 感應距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
| MC33797BPEW | 功能描述:功率驅動器IC Four Channel Squib Dr RoHS:否 制造商:Micrel 產品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時間: 下降時間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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