- 您現(xiàn)在的位置：買賣IC網 > PDF目錄359729 > MC33288DH (MOTOROLA INC) Solid State Relay for Automotive Flasher Applications PDF資料下載
參數(shù)資料
| 型號： | MC33288DH |
| 廠商： | MOTOROLA INC |
| 元件分類： | 消費家電 |
| 英文描述： | Solid State Relay for Automotive Flasher Applications |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO20 |
| 封裝： | HSOP-20 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大小： | 382K |
| 代理商： | MC33288DH |
MC33288
Solid State Relay for Automotive Flasher Applications
Go to: www.freescale.com
7
Soldering Information
This device is packaged in a Surface Mount Power
package indended to be soldered directly on the Printed
Circuit Board.
This device was qualified according to JEDEC standards
JESD22-A113-B and J-STD-020A with the reflow conditions
applicable for packages with thickness above 2.5mm :
Convection 220
°
C +5/-0
°
C
VPR 215-219
°
C
IR / Convection 220
°
C +5/-0
°
C
The maximum peak temperature during the soldering process
should not exceed 220
°
C (+5
°
C/-0
°
C). The time at maximum
temperature should range from 10 to 40s max.
Thermal Management
The junction to case thermal resistance is 2
°
C/W
maximum. The junction to ambient thermal resistance is
dependent on the mounting technology and the addition of
heat sink. One of the most commonly used mounting
technique consists in using the printed circuit board and the
copper lines as heat sink.
Figure 1.
Printed Board Layout Example (not to scale)
Figure 1 shows an example of printed circuit board layout.
It has a total of 10cm
2
additional copper on two sides (2.5 cm
2
on the top side and 7.5 cm
2
on the down side).
With the above layout, thermal resistance junction to ambient
of 25
°
C/W can be achieved, this value being splitted into :
junction to case : Rthjc1 = Rthjc2 = 2
°
C/W
case to ambient : Rthca = 23
°
C/W.
Lower value can be reached with the help of larger and
thicker copper metal, higher number of thermal via from top to
down side pcb and the use of additional thermal via from the
circuit board to the module case.
Steady State Thermal Model
The junction to ambient thermal resistance of the circuit
mounted on a printed circuit board can be splitted into two
main parts : junction to case and case to ambient resistances.
A simplified steady state model is shown in figure 2.
Figure 2.
Simplified Thermal Model (Electrical Equivalent)
Transient Thermal Model
A more complete model including thermal capacitance is
proposed in figure 3.
Figure 3. Transient thermal model
This gives a thermal impedance versus time (figure 4), which
has been determined with the printed circuit board shown in
figure 1.
Figure 4. Junction to ambiant Thermal impedance
This figure shows that the steady state is reached after about
10 minutes. It also clearly shows that the device can dissipate
almost twice the power within one minute compared to the
maximum allowed power dissipation in steady state.
Down side pcb
8 cm
Top side pcb
2 cm
HSOP20
external pcb (4x4 cm)
Thermal
via from
top to down
side pcb
Rthca
Rthjc2
2
°
C/W
Rthjc1
2
°
C/W
Chan 1 Junction
Temp Node
(Volts represent Die
Surface Temperature)
Ambient Temp Node
Chan 2
Power (W)
Case Temp Node
Chan 2 Junction
Temp Node
Chan 1
Switch
Chan 2
Switch
Chan 1
Power (W)
(1.0A=1W of
Power Dissipation)
(1.0V=1
°
C)
(1.0
=1
°
C/W)
25
°
C/W
AmbientTemperature
MOS1
MOS2
Control
Case
Board
Ambiant
3K/W
3K/W
3K/W
450K/W
3K/W
20K/W
6J/K
0.5J/K
4mJ/K
5mJ/K
5mJ/K
1mJ/K
3.5K/W
3.5K/W
300K/W
MOS3
30
20
10
0
0
100
200
300
500
600
700
800
T
°
C
Time (sec.)
Freescale Semiconductor, Inc.
相關PDF資料 |
PDF描述 |
|---|---|
| MC33288DHR2 | Solid State Relay for Automotive Flasher Applications |
| MC68HC11D0 | Microcontrollers |
| MC68HC11D0CFB2 | Microcontrollers |
| MC68HC11D0CFB3 | Microcontrollers |
| MC68HC11D0CFN2 | Microcontrollers |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC33289 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 10.2/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEATSINK TO220 10.2C/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:10.2C/W; External Height - Imperial:1.496"; External Height - Metric:38mm; External Width - Imperial:1.358"; External Width - Metric:34.5mm; External Length - Imperial:0.492" ;RoHS Compliant: Yes |
| MC33289DW | 功能描述:電源開關 IC - 配電 DUAL HIGH SIDE SWITCH RoHS:否 制造商:Exar 輸出端數(shù)量:1 開啟電阻（最大值）:85 mOhms 開啟時間（最大值）:400 us 關閉時間（最大值）:20 us 工作電源電壓:3.2 V to 6.5 V 電源電流（最大值）: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-23-5 |
| MC33289DWR2 | 功能描述:電源開關 IC - 配電 DUAL HIGH SIDE SWITCH RoHS:否 制造商:Exar 輸出端數(shù)量:1 開啟電阻（最大值）:85 mOhms 開啟時間（最大值）:400 us 關閉時間（最大值）:20 us 工作電源電壓:3.2 V to 6.5 V 電源電流（最大值）: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-23-5 |
| MC33290 | 制造商:SPC Multicomp 功能描述:HEATSINK TO220 8.8/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEATSINK TO220 8.8C/W 3 HOLES 制造商:SPC Multicomp 功能描述:HEAT SINK; Packages Cooled:TO-220; Thermal Resistance:8.8C/W; External Height - Imperial:1.969"; External Height - Metric:50mm; External Width - Imperial:1.358"; External Width - Metric:34.5mm; External Length - Imperial:0.492" ;RoHS Compliant: Yes |
| MC33290D | 功能描述:IC SER LNK INTER ISO KLINE 8SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標準包裝:3,000 系列:- 應用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應商設備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2 |
發(fā)布緊急采購，3分鐘左右您將得到回復。