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參數(shù)資料
| 型號： | MC3100EP35DTG |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | 3.3V / 5V ECL JK Flip−Flop |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 164K |
| 代理商： | MC3100EP35DTG |
MC10EP35, MC100EP35
http://onsemi.com
10
PACKAGE DIMENSIONS
TSSOP
8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R
02
ISSUE A
DIM
A
B
C
D
F
G
K
MIN
2.90
2.90
0.80
0.05
0.40
0.65 BSC
0.25
MAX
3.10
3.10
1.10
0.15
0.70
MIN
0.114
0.114
0.031
0.002
0.016
0.026 BSC
0.010
MAX
0.122
0.122
0.043
0.006
0.028
INCHES
MILLIMETERS
L
M
4.90 BSC
0
0.193 BSC
0
6
6
SEATING
PLANE
PIN 1
1
4
8
5
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X
L/2
U
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V
S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
8x REF
0.40
0.016
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE W.
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