
MC145423
TELECOMMUNICATIONS
28
DT SUFFIX
TSSOP PACKAGE
CASE 1168-01
NOTES:
1.
DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE MOLD PROTRUSION IS
0.15 PER SIDE.
4.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR MOLD PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25 PER
SIDE.
5.
DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSIONS. DAMBAR PROTRUSION SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.38.
DIM
MIN
MAX
MILLIMETERS
A
---
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
b1
0.19
0.25
c
0.09
0.20
c1
0.09
0.16
D
9.60
9.80
e
0.65 BSC
E
6.40 BSC
E1
4.30
4.50
L
0.50
0.70
θ
0
8
θ
14 REF
1
(D)
D
E
E/2
e/2
e
2X
26X
1
28
14
15
E1
B
C
AB
0.2
C
PIN 1
INDEX
TOP VIEW
2X 14 TIPS
VIEW A
END
VIEW
0.05
SIDE VIEW
A
28X b
B
M
0.1
C
A
A
28X
A
0.2
SEATING PLANE
A
VIEW A
L
°
A2
A1
GAGE
PLANE
(
θ 1
°)
θ°
0.25
b1
c1
(b)
c
SECTION A-A
TELECOMMUNICATIONS
25
MC145423
B
ASI
C
DI
GIT
A
L
TELSET
1k
68
F
FS
R
DT
FS
T
BC
LK
T
BC
LK
R
10
0k
TI
–
PO
–
PO
+
TG
TI
+
PI
RO
–
PD
10
M
V
SS
OS
C
in
OC
S
out
OP
OH
/T
TS
O
MO
MS
DT
MF
OU
T
1.
8k
N
=
4
M
S
I/TON
E
2.
048
M
H
z
SDO
1
SDO
2
S
DCL
K
Rx
R
E
1/
CL
K
ou
t
V
AG
1.
0
F
M
u/A
27
0
V
SS
TD
C-R
DC/
XT
AL
ou
t
SE
/(
Mu
/A
)
S
DI1
F
R
AM
E
10/
20
MA
ST
E
R
/S
LA
VE
LO
1
LO
2
M
O
D
TR
I/S
Q
PD
LB
LI
V
ref
VD
V
DD
CC
I/X
TA
L
in
E
N
2-
TE
2
(
I/O
)/
SI
E
N1-
TE1
(I/
O
)
RE
2/
B
C
LK
SD
I2
Tx
MC
LK
V
AG
-RE
F
V
SS
DR
V
DD
MIC
M
C14
84
V
DD
M
C
1
454
23
UD
LT
-3
SL
A
V
E
MO
DE
P
U
LS
E
T
O
N
E
DI
AL
E
R
78
M0
5
L
M31
7
50
F
33
V
2W
5
V
4
.7
F
10
V
4
.7
F
10
V
SP
EA
KE
R
10
k
5V
RE
C
1k
1k
1.
0
F
1k
0.
1
F
75
k
42
0
p
F
5V
4
.7
k
4.7
k
5V
5
V
N
=
0
.5
N
=
0.
5
N
=
2
TIP
RIN
G
11
0
11
0
11
0
11
0
5V
20
4
.09
6M
H
z
20
pF
20
pF
RO
W
&
COL
KE
YP
A
D
5
V
3
.58
M
H
z
0
.01
F
re
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sc
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S
e
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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c
..
.
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